An edition of Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2 (2006)

Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2

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Advanced Manufacturing Process, Lead Free Int ...
C. Bailey, J. Liu
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January 30, 2024 | History
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An edition of Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2 (2006)

Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2

by and

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publisher
Emerald Publishing Limited
Language
English

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Cover of: Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2
Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2
2006, Emerald Publishing Limited
in English
  • Not in Library
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Pagination
72

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Open Library
OL50597593M
ISBN 13
9781280547577

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January 30, 2024 Created by ImportBot Imported from Better World Books record