An edition of Microelectronic packaging and laser processing (1997)

Microelectronic packaging and laser processing

25-26 June 1997, Singapore

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  • 1 Want to read
Cover of: Microelectronic packaging and laser processing by Ray T. Chen
Microelectronic packaging and laser processing by Ray T. Chen
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Last edited by MARC Bot
July 12, 2024 | History
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An edition of Microelectronic packaging and laser processing (1997)

Microelectronic packaging and laser processing

25-26 June 1997, Singapore

by

  • 1 Want to read

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
SPIE
Language
English
Pages
230

Previews available in: English

Subjects

Congresses Microelectronic packaging Microelectronics Electronic packaging Lasers
Edition Availability
Cover of: Microelectronic packaging and laser processing
Microelectronic packaging and laser processing: 25-26 June 1997, Singapore
1997, SPIE
in English

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Book Details

Edition Notes

Includes bibliographic references and author index.

Published in
Bellingham, Wash
Series
SPIE proceeding series,, v. 3184, Proceedings of SPIE--the International Society for Optical Engineering ;, v. 3184.

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7874 .M4586 1997

The Physical Object

Pagination
vii, 230 p. :
Number of pages
230

Edition Identifiers

Open Library
OL418331M
Internet Archive
microelectronicp3184unse
ISBN 10
0819426113
LCCN
98122038
OCLC/WorldCat
37699531
Goodreads
5077506

Work Identifiers

Work ID
OL18969793W

Source records

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{{cite book|author=Ray T. Chen |date=1997 |title=Microelectronic packaging and laser processing |url=https://archive.org/details/microelectronicp3184unse |publication-place=Bellingham, Wash |publisher=SPIE |isbn=0-8194-2611-3 |lccn=98122038 |oclc=37699531 |ol=418331M}}