An edition of Force Sensors for Microelectronic Packaging Applications
(2004)
Force Sensors for Microelectronic Packaging Applications
by Jürg Schwizer, Michael Mayer, and Oliver Brand
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Electronic packaging, Metal bonding| Edition | Availability |
|---|---|
1
Force Sensors for Microelectronic Packaging Applications
Dec 15, 2010, Springer
paperback
3642060633 9783642060632
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2
Force Sensors for Microelectronic Packaging Applications
2004, Springer London, Limited
in English
3540269452 9783540269458
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Book Details
Edition Notes
Source title: Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)
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- Created May 31, 2020
- 2 revisions
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| September 11, 2021 | Edited by ImportBot | import existing book |
| May 31, 2020 | Created by ImportBot | Imported from amazon.com record |