An edition of Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging
(2007)
Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
by Ephraim Suhir, Y.C. Lee, and C.P. Wong
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Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
Aug 23, 2016, Springer
paperback
1489978852 9781489978851
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Source title: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
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- Created May 18, 2020
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| February 27, 2022 | Edited by ImportBot | import existing book |
| May 18, 2020 | Created by ImportBot | Imported from amazon.com record |