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Last edited by ImportBot
December 4, 2009 | History

Yufeng Jin

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4 works Add another?

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  • Cover of: Introduction to microsystem packaging technology

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  • Cover of: TSV 3D RF Integration: High Resistivity Si Interposer Technology

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  • Cover of: Wei mi na mi qi jian feng zhuang ji shu: Micro-Nanometer Devices Packaging Technology

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  • Cover of: Introduction to microsystem packaging technology

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December 4, 2009 Created by ImportBot new author