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Subjects
Aluminum alloys, Analysis, Applications programs (Computers), Congresses, Crack propagation, Crack tips, Defects, Design and construction, Environmental tests, Fatigue life, Integrated circuits, Metal fatigue, Microelectronics industry, Quality control, Semiconductor wafers, Semiconductors, Strain rate, Stress corrosionID Numbers
- OLID: OL4874653A
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September 19, 2008 | Created by ImportBot | Imported from Oregon Libraries MARC record |