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Subjects
Congresses, Engineering - General, Engineering thermodynamics, Expansion (Heat), Expansion (heat), General, Heat, conduction, Material Science, Materials, Materials, thermal properties, Nanostructures, Physics, Science, Science/Mathematics, Technology, Technology / Material Science, Technology: General Issues, Thermal conductivity, Thermal propertiesID Numbers
- OLID: OL3058464A
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April 30, 2008 | Created by an anonymous user | initial import |