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Last edited anonymously
April 29, 2008 | History
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Kenneth A. Jackson

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5 works Add another?

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  • Cover of: Electronic Packaging Materials Science III (Materials Research Society Symposium Proceedings, Vol 108)

    First published in 1988 — 3 editions
    Not in Library

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  • Cover of: Materials Science and Technology: A Comprehensive Treatment, Vol. 16, Processing of Semiconductors

    First published in 1996 — 2 editions
    Not in Library

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  • Cover of: Electronic Packaging Materials Science IV: Symposium Held April 24-28, 1989, San Diego, California, U.S.A. (Materials Research Society Symposium Proceedings)

    First published in 1989 — 1 edition
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  • Cover of: Electronic Packaging Materials Science VI: Symposium Held April 27-30, 1992, San Francisco, California, U.S.A. (Materials Research Society Symposium Proceedings)

    First published in 1993 — 1 edition
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  • Cover of: Compound Semiconductor Devices: Structures and Processing

    First published in 1998 — 1 edition
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Subjects

Electronic packaging, Materials, Semiconductors, Compound semiconductors, Congresses, Electronic Engineering (Specific Aspects), Electronic apparatus and appliances, packaging, Electronics - General, Extrusion, Industrial applications, Materials For Engineering, Materials, mechanical properties, Materials, research, Packaging, Polymers, Research, Technology & Industrial Arts, Thermodynamics

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ID Numbers

  • OLID: OL2950028A

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History

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April 29, 2008 Created by an anonymous user initial import