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Subjects
Design and construction, Electronic packaging, Céramique électronique, Digital, Electronic ceramics, Electronics, Interconnects (Integrated circuit technology), Materials, Matériaux, Microelectronics, Mise sous boîtier (Électronique), TECHNOLOGY & ENGINEERING, Thin film devices, Thin filmsID Numbers
- OLID: OL2633661A
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April 29, 2008 | Created by an anonymous user | initial import |