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Last edited by RenameBot
September 7, 2008 | History
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Michael Pecht

36 works Add another?

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  • Cover of: The Chinese Electronics Industry

    First published in 1999 7 editions in 1 language
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  • Cover of: The Japanese electronics industry: Wataru Nakayama, William Boulton, Michael Pecht.

    First published in 1999 7 editions in 1 language — 1 previewable
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  • Cover of: Placement and routing of electronic modules

    First published in 1993 6 editions in 1 language
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  • Cover of: Guidebook for Managing Silicon Chip Reliability

    First published in 2017 5 editions in 1 language
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  • Cover of: Korean Electronics Industry

    First published in 2018 5 editions in 1 language
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  • Cover of: Electronics Industry in Taiwan

    First published in 2020 5 editions in 1 language
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  • Cover of: Lead-free electronics

    First published in 2006 5 editions in 1 language — 1 previewable
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  • Cover of: Handbook of electronic package design

    First published in 1991 5 editions in 1 language
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  • Cover of: Parts Selection and Management

    First published in 2005 4 editions in 1 language
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  • Cover of: Electronic Packaging Materials and Their Properties

    First published in 2017 3 editions in 1 language
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  • Cover of: Contamination of Electronic Assemblies (Electronic Packaging)

    First published in 2002 3 editions in 1 language — 1 previewable
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  • Cover of: Product reliability, maintainability, and supportability handbook

    First published in 2009 3 editions in 1 language — 1 previewable
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  • Cover of: Reliability Monitoring Using Sensor Technologies

    First published in 2006 2 editions in 1 language
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  • Cover of: Reliability of Power Electronic Converter Systems

    First published in 2015 2 editions in 1 language
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  • Cover of: The Korean electronic industry

    First published in 1997 2 editions in 1 language — 1 previewable
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  • Cover of: Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability

    First published in 1994 2 editions in 1 language — 1 previewable
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  • Cover of: Electronic packaging materials and their properties

    First published in 1999 2 editions in 1 language — 1 previewable
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  • Cover of: Prognostics and Health Management of Electronics

    First published in 2008 1 edition in 1 language
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  • Cover of: Placement and Routing of Electronic Modules

    First published in 1993 1 edition in 1 language
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  • Cover of: Advanced routing of electronic modules

    First published in 1996 1 edition in 1 language
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Subjects
Electronic packaging, Electronic apparatus and appliances, Reliability, Electronic industries, General, Industries électroniques, TECHNOLOGY & ENGINEERING, BUSINESS & ECONOMICS, Electronic apparatus and appliances, maintenance and repair, Electronics, Mechanical, Design and construction, Electricity, Electronic apparatus and appliances, reliability, Engineering - Electrical & Electronic, Fiabilité, Handbooks, manuals, Hi-tech manufacturing industries, Industries, Industries - General, Integrated circuits, Maintainability, Materials, TECHNOLOGY, Technology / Electronics / General
Places
China, Japan, Korea (South)

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ID Numbers

  • OLID: OL227989A

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History

Download catalog record: RDF / JSON
September 7, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import