An edition of Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1 (2019)

Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1

Die-Attach and Wafer Bonding Technology

by , , and

Cover of: Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1 by Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay, Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay
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Last edited by ImportBot
August 17, 2023 | History
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An edition of Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1 (2019)

Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1

Die-Attach and Wafer Bonding Technology

by , , and

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Publish Date
Publisher
World Scientific Publishing Company
Pages
1080

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Cover of: Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology
Oct 18, 2019, World Scientific Publishing Company
hardcover
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Book Details

Edition Notes

Source title: Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)

Classifications

Library of Congress
TS195.E63 2020

The Physical Object

Format
hardcover
Number of pages
1080

ID Numbers

Open Library
OL47319608M
ISBN 10
9811201110
ISBN 13
9789811201110

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August 17, 2023 Edited by ImportBot import existing book
April 6, 2023 Created by ImportBot import new book