An edition of Reliability and Failure Analysis of High Power LED Packaging (2021)

Reliability and Failure Analysis of High Power LED Packaging

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Cover of: Reliability and Failure Analysis of High Power LED Packaging by Cher Ming Tan, Preetpal Singh, Cher Ming Tan, Preetpal Singh
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June 15, 2021 | History
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An edition of Reliability and Failure Analysis of High Power LED Packaging (2021)

Reliability and Failure Analysis of High Power LED Packaging

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Publish Date
Publisher
Woodhead Publishing
Pages
265

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Edition Availability
Cover of: Reliability and Failure Analysis of High Power LED Packaging
Reliability and Failure Analysis of High Power LED Packaging
2022, Elsevier Science & Technology
in English
Cover of: Reliability and Failure Analysis of High Power LED Packaging
Reliability and Failure Analysis of High Power LED Packaging
Nov 15, 2021, Woodhead Publishing
paperback

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Book Details

Edition Notes

Source title: Reliability and Failure Analysis of High Power LED Packaging (Woodhead Publishing Series in Electronic and Optical Materials)

The Physical Object

Format
paperback
Number of pages
265

Edition Identifiers

Open Library
OL32636315M
ISBN 10
0128224088
ISBN 13
9780128224083

Work Identifiers

Work ID
OL24604277W

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June 15, 2021 Created by ImportBot import new book