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| Edition | Availability |
|---|---|
1
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Jan 30, 2019, Springer
paperback
9811355851 9789811355851
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2
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Sep 08, 2017, Springer
hardcover
9811061645 9789811061646
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Source title: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)
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