| Record ID | marc_western_washington_univ/wwu_bibs.mrc_revrev.mrc:767905886:1192 |
| Source | Western Washington University |
| Download Link | /show-records/marc_western_washington_univ/wwu_bibs.mrc_revrev.mrc:767905886:1192?format=raw |
LEADER: 01192nam 22003254a 4500
001 ocm48534655
003 OCoLC
005 20021031124628.0
008 020215s2002 nyua b 001 0 eng
010 $a2002022737
020 $a0071378820 (alk. paper)
040 $aDLC$cDLC$dYDX$dUKM$dXFF
042 $apcc
049 $aXFFA
050 00 $aTK7870$b.E4424 2002
245 00 $aElectronic assembly fabrication :$bchips, circuit boards, packages, and components /$cCharles A. Harper, editor-in-chief.
250 $a1st ed.
260 $aNew York :$bMcGraw-Hill,$cc2002.
300 $axv, 672 p. :$bill. ;$c24 cm.
440 0 $aMcGraw-Hill professional engineering
440 0 $aElectronic packaging and interconnection series
504 $aIncludes bibliographical references and index.
650 0 $aElectronic apparatus and appliances$xDesign and construction.
700 1 $aHarper, Charles A.
856 42 $zPublisher's web site$uhttp://www.loc.gov/catdir/description/mh024/2002022737.html
856 41 $3Table of contents online$uhttp://www.loc.gov/catdir/toc/mh023/2002022737.html
907 $a.b19816698$bmulti$c-
902 $a070705
998 $b1$c021031$dm$ea$f-$g0
902 $ass