| Record ID | marc_records_scriblio_net/part15.dat:159266330:1551 |
| Source | Scriblio |
| Download Link | /show-records/marc_records_scriblio_net/part15.dat:159266330:1551?format=raw |
LEADER: 01551cam 22003377a 4500
001 2005297971
003 DLC
005 20050729090953.0
008 050503s2003 nyua b 101 0 eng d
010 $a 2005297971
040 $aLHL$cLHL$dHNK$dDLC
020 $a0791837149
035 $a(OCoLC)ocm54432970
042 $alccopycat
050 00 $aTK7870.15$b.E392 2003
245 00 $aElectronic and photonic packaging, electrical systems and photonic design, and nanotechnology :$bpresented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C. /$csponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.].
260 $aNew York, N.Y. :$bAmerican Society of Mechanical Engineers,$cc2003.
300 $axi, 893 p. :$bill. ;$c28 cm.
490 1 $aEPP ;$vvol. 3
504 $aIncludes bibliographical references and index.
650 0 $aElectronic packaging$vCongresses.
650 0 $aPhotonics$vCongresses.
650 0 $aNanotechnology$vCongresses.
650 0 $aMicroelectronic packaging$vCongresses.
650 0 $aSurface mount technology$vCongresses.
650 0 $aMicroelectromechanical systems$vCongresses.
650 0 $aIntegrated circuits$xWafer-scale integration$vCongresses.
700 1 $aLee, S. W. Ricky
710 2 $aAmerican Society of Mechanical Engineers.$bElectronic and Photonic Packaging Division.
711 2 $aInternational Mechanical Engineering Congress and Exposition$d(2003 :$cWashington, D.C.)
830 0 $aEPP (Series) ;$vv. 3.