| Record ID | marc_loc_updates/v39.i20.records.utf8:15669028:1234 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_updates/v39.i20.records.utf8:15669028:1234?format=raw |
LEADER: 01234nam a22003138a 4500
001 2011015480
003 DLC
005 20110513154601.0
008 110408s2011 nju b 001 0 eng
010 $a 2011015480
020 $a9780470827833 (hardback)
040 $aDLC$cDLC
042 $apcc
050 00 $aTK7871.89.L53$bL58 2011
082 00 $a621.3815/22$223
084 $aTEC008010$2bisacsh
100 1 $aLiu, S.$q(Sheng),$d1963-
245 10 $aLED packaging for lighting applications :$bdesign, manufacturing, and testing /$cSheng Liu, Xiaobing Luo.
260 $aHoboken, N.J. :$bWiley,$c2011.
263 $a1105
300 $ap. cm.
520 $a"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--$cProvided by publisher.
504 $aIncludes bibliographical references and index.
650 0 $aLight emitting diodes$xDesign and construction.
650 0 $aLight emitting diodes$xComputer simulation.
650 0 $aElectronic packaging.
650 0 $aElectric lighting$xEquipment and supplies.
650 7 $aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General$2bisacsh.
700 1 $aLuo, Xiaobing,$d1974-