| Record ID | marc_loc_2016/BooksAll.2016.part36.utf8:271468930:1121 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part36.utf8:271468930:1121?format=raw |
LEADER: 01121cam a22003257a 4500
001 2009417108
003 DLC
005 20110801114212.0
008 090407s2008 gw a b 001 0 eng
010 $a 2009417108
015 $aGBA8A2148$2bnb
016 7 $a014470978$2Uk
020 $a9783527320349 (set)
020 $a3527320342 (set)
035 $a(OCoLC)ocn244648058
040 $aUKM$cUKM$dBWX$dYDXCP$dIWA$dPUL$dDLC
042 $aukblsr$alccopycat
082 04 $a621.3815$222
050 00 $aTK7874$b.H348 2008
245 00 $aHandbook of 3D integration :$btechnology and applications of 3D integrated circuits /$cedited by Philip Garrou, Christopher Bower and Peter Ramm.
260 $aWeinheim :$bWiley-VCH,$cc2008.
300 $a2 v. :$bill. (some col.) ;$c25 cm.
504 $aIncludes bibliographical references and index.
650 0 $aThree-dimensional integrated circuits.
650 0 $aIntegrated circuits$xDesign and construction.
650 0 $aSemiconductor wafers.
650 0 $aThree-dimensional imaging.
700 1 $aGarrou, Philip E.
700 1 $aBower, Christopher Andrew.
700 1 $aRamm, Peter.