| Record ID | marc_loc_2016/BooksAll.2016.part36.utf8:150968118:971 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part36.utf8:150968118:971?format=raw |
LEADER: 00971cam a2200289 a 4500
001 2009045580
003 DLC
005 20130607075300.0
008 091118s2011 flua b 001 0 eng
010 $a 2009045580
015 $aGBB012249$2bnb
016 7 $a015479208$2Uk
020 $a9781439819104 (hardcover : alk. paper)
020 $a1439819106 (hardcover : alk. paper)
035 $a(OCoLC)ocn377864839
040 $aDLC$cDLC$dYDX$dBTCTA$dUKM$dYDXCP$dCDX$dDLC
042 $apcc
050 00 $aTK7870.15$b.J56 2011
082 00 $a621.381/046$222
100 1 $aJin, Yufeng.
245 10 $aIntroduction to microsystem packaging technology /$cYufeng Jin, Zhiping Wang, Jing Chen.
260 $aBoca Raton, FL :$bCRC Press/Taylor & Francis,$cc2011.
300 $axiii, 218 p. :$bill. ;$c27 cm.
504 $aIncludes bibliographical references and index.
650 0 $aMicroelectronic packaging.
700 1 $aWang, Zhiping,$d1962- October 6-
700 1 $aChen, Jing,$d1974-