| Record ID | marc_loc_2016/BooksAll.2016.part29.utf8:186292016:1111 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part29.utf8:186292016:1111?format=raw |
LEADER: 01111cam a22002774a 4500
001 2002022737
003 DLC
005 20040707130344.0
008 020215s2002 nyua 000 0 eng
010 $a 2002022737
020 $a0071378820 (alk. paper)
040 $aDLC$cDLC$dDLC
042 $apcc
050 00 $aTK7870$b.E4424 2002
082 00 $a621.381$221
245 00 $aElectronic assembly fabrication :$bchips, circuit boards, packages, and components /$cCharles A. Harper, editor-in-chief.
250 $a1st ed.
260 $aNew York :$bMcGraw-Hill,$cc2002.
300 $axv, 672 p. :$bill. ;$c24 cm.
440 0 $aMcGraw-Hill professional engineering
440 0 $aElectronic packaging and interconnection series
650 0 $aElectronic apparatus and appliances$xDesign and construction.
700 1 $aHarper, Charles A.
856 42 $3Contributor biographical information$uhttp://www.loc.gov/catdir/bios/mh041/2002022737.html
856 42 $3Publisher description$uhttp://www.loc.gov/catdir/description/mh024/2002022737.html
856 41 $3Table of contents$uhttp://www.loc.gov/catdir/toc/mh023/2002022737.html