MARC Record from marc_columbia

LEADER: 06167cam a2200721 i 4500
001 15663285
005 20220521224321.0
006 m o d
007 cr cnu---unuuu
008 191214t20192019ohua obf 001 0 eng d
035 $a(OCoLC)on1128706105
035 $a(NNC)15663285
040 $aEBLCP$beng$erda$epn$cEBLCP$dYDXIT$dOCLCO$dYDX$dN$T$dOCLCF$dOCLCQ$dOSU$dSFB$dMM9$dOCLCQ$dCUV$dOCLCO
019 $a1128199507$a1132286236$a1144338218
020 $a9781627082471$q(electronic book)
020 $a1627082476$q(electronic book)
020 $a9781627082464$q(electronic bk.)
020 $a1627082468$q(electronic bk.)
020 $a9781523126323$q(electronic bk.)
020 $a1523126329$q(electronic bk.)
020 $z9781627082457$q(print)
020 $z162708245X$q(print)
035 $a(OCoLC)1128706105$z(OCoLC)1128199507$z(OCoLC)1132286236$z(OCoLC)1144338218
050 4 $aTK7871$b.M52 2019
082 04 $a621.381$223
049 $aZCUA
245 00 $aMicroelectronics failure analysis :$bdesk reference /$cedited by Tejinder Gandhi.
250 $aSeventh edition.
264 1 $aMaterials Park, Ohio :$bASM International,$c[2019]
264 4 $c©2019
300 $a1 online resource (xi, 705 pages) :$billustrations (some color)
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
500 $a"An ASM materials solutions publication."
500 $a"EDFAS, Electronic Device Failure Analysis Society, ASM International."
504 $aIncludes bibliographical references and indexes.
505 0 $aIntro; 01_Overview of Wafer-level Electrical Failure_Pai inputs_addressed; 03_EDFAS Desk Reference Paper -- Susan Li -- 8-5-2019 -- Final; 04_Non-destructive Techniques for Advanced Board Level Failure Analysis; 05_EDFAS Desk Refrence -- FA Lab management article-final; 06_07A Optical Microscopy for Desk Reference 2010_corrected; 07_X-ray imaging tools for electronic device failure analysis_CSFinal_V4; 08_!PUB-2019_EDFAS_SAM_Update_Final-20190731; Acoustic Microscopy of Semiconductor Packages; Cheryl D. Hartfield; Carl Zeiss SMT Inc., Pleasanton, CA, USA; cheryl.hartfield@zeiss.com
505 8 $aThomas M. MooreWaviks Inc., Dallas, TX, USA; tom.moore@waviks.com; Sebastian Brand; Fraunhofer IMWS, Halle, Germany; sebastian.brand@imws.fraunhofer.de; Introduction; History; The C-scan; The Stanford SAM; Today's SAM for IC Package Inspection; Early SAM Applications in the IC Industry; An Important Tool for Popcorn Crack Detection; Theoretical Considerations; Overview: Acoustic Microscopy for IC Package Inspection; Types of Reflected Signal Analysis Modes:; Polarity Analysis of Reflected Signals; Time of Flight Imaging Using Reflected Signals; Resolution and Sensitivity of SAM Inspection
505 8 $aTransducer SelectionContrast mechanisms in acoustic imaging; Focusing of acoustic waves; Practical Applications of Conventional SAM; Plastic Package Inspection; Inspection of Packages Having High Velocity Substrates; Strategies for Inspection of Packages Having Thin Layers; Imaging Flip Chip Devices; Complementary Nondestructive Techniques; Current Challenges and New Developments; Stacked Die Packages and Increasing 3D Structures; Signal Analysis in Acoustic Microscopy for Enhanced Defect Detection Capabilities; Spectral Analysis and Split-Spectrum Imaging (SSP); Automated Bump Inspection
505 8 $aCrack Detection by Multimode and Shear-Wave ImagingExtending Package Inspection Capability with Acoustic Ghz-Microscopy: Potential, Application and Challenges; GHz-SAM Imaging of Wirebond Interfaces and Bond Pads; GHz-SAM for the Inspection of Bonding Interfaces in Wafer Bonding; GHz-SAM Inspection for Void Formation in Metallization Lines for Automotive Applications; Inspection of TSVs Using Acoustic GHz-Microscopy; Photo-acoustic GHz-microscopy: an emerging technique?; Summary; Author Contributions; References; 09_04C Srikanth_Keim_Eide__Diagnosis; 010_aorozco-edfas-deskref-7th-ed-v16
505 8 $a011_TDR_EOTPR_TDT_desk_reference_ASM_r4012_Frontsidefinal_9-3-2019; 013_Backside Preparation and Optics Revision4; 014_Corrected Photon emission article (1); 015_Beam fault isolation corrected; 016_Desk Ref_7thEdition_ Thermal detection_V7_new title_rev1; 017_Desk Ref_7thEdition_3DLIT_V6.1; 018_LADA_SDL_Desk_Reference_Final_Final; 019_Laser Voltage Probing Article -; 020_EDFAS_CAD_Navigation_Principles_7th-Ed; 021_05C MDR_Rosenkranz; 022_EDFAS. Transistor Characterization(Final)_8_30; 023_Fundamentals_Nanoprobe_Final; 024_Silicon Device
588 0 $aPrint version record.
650 0 $aElectronics$xMaterials$xTesting$vHandbooks, manuals, etc.
650 0 $aMicroelectronics$xMaterials$xTesting$vHandbooks, manuals, etc.
650 0 $aMicroelectronics$xMaterials$xDefects$vHandbooks, manuals, etc.
650 0 $aElectronic apparatus and appliances$xTesting$vHandbooks, manuals, etc.
650 0 $aSemiconductors$xDefects$vHandbooks, manuals, etc.
650 6 $aMicroélectronique$xDéfauts$vGuides, manuels, etc.
650 6 $aAppareils électroniques$xEssais$vGuides, manuels, etc.
650 6 $aSemi-conducteurs$xDéfauts$vGuides, manuels, etc.
650 7 $aElectronic apparatus and appliances$xTesting.$2fast$0(OCoLC)fst00906837
650 7 $aElectronics$xMaterials$xTesting.$2fast$0(OCoLC)fst00907571
650 7 $aMicroelectronics$xMaterials$xDefects.$2fast$0(OCoLC)fst01019772
650 7 $aMicroelectronics$xMaterials$xTesting.$2fast$0(OCoLC)fst01019774
650 7 $aSemiconductors$xDefects.$2fast$0(OCoLC)fst01112211
655 7 $aHandbooks and manuals.$2fast$0(OCoLC)fst01423877
700 1 $aGandhi, Tejinder,$eeditor.
710 2 $aASM International,$eissuing body.
710 2 $aElectronic Device Failure Analysis Society,$econtributor.
776 08 $iPrint version:$tMicroelectronics failure analysis.$bSeventh edition.$dMaterials Park, Ohio : ASM International, 2019$z9781627082457$w(DLC) 2019951107$w(OCoLC)1126332918
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15663285$zACADEMIC - Electronics & Semiconductors
852 8 $blweb$hEBOOKS