| Record ID | marc_columbia/Columbia-extract-20221130-031.mrc:87430814:3547 |
| Source | marc_columbia |
| Download Link | /show-records/marc_columbia/Columbia-extract-20221130-031.mrc:87430814:3547?format=raw |
LEADER: 03547cam a2200589Ia 4500
001 15082389
005 20220604232358.0
006 m o d
007 cr |||||||||||
008 110601s2011 flua ob 001 0 eng d
035 $a(OCoLC)ocn727983482
035 $a(NNC)15082389
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015 $aGBB7A8904$2bnb
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020 $a9781439865972$q(electronic bk.)
020 $a1439865973$q(electronic bk.)
020 $a9781628706727$q(electronic bk.)
020 $a1628706724$q(electronic bk.)
020 $z9781439819104$q(hardcover ;$qalk. paper)
020 $z1439819106$q(hardcover ;$qalk. paper)
035 $a(OCoLC)727983482$z(OCoLC)991897579$z(OCoLC)994898680$z(OCoLC)1015206715$z(OCoLC)1063887290
037 $aTANDF_234472$bIngram Content Group
050 4 $aTK7870.15$b.J56 2011
072 7 $aTEC$x008060$2bisacsh
072 7 $aTEC$x008070$2bisacsh
082 04 $a621.381/046$222
049 $aZCUA
100 1 $aJin, Yufeng.
245 10 $aIntroduction to microsystem packaging technology /$cYufeng Jin, Zhiping Wang, Jing Chen.
260 $aBoca Raton, FL :$bCRC Press/Taylor & Francis,$c©2011.
300 $a1 online resource (xiii, 218 pages) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
504 $aIncludes bibliographical references and index.
588 0 $aPrint version record.
505 0 $aCh. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
520 $aThe multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics.
650 0 $aMicroelectronic packaging.
650 6 $aMise sous boîtier (Microélectronique)
650 7 $aTECHNOLOGY & ENGINEERING$xElectronics$xDigital.$2bisacsh
650 7 $aTECHNOLOGY & ENGINEERING$xElectronics$xMicroelectronics.$2bisacsh
650 7 $aMicroelectronic packaging.$2fast$0(OCoLC)fst01019751
655 0 $aElectronic books.
655 4 $aElectronic books.
700 1 $aWang, Zhiping,$d1962 October 6-
700 1 $aChen, Jing,$d1974-
776 08 $iPrint version:$aJin, Yufeng.$tIntroduction to microsystem packaging technology.$dBoca Raton, FL : CRC Press/Taylor & Francis, ©2011$z9781439819104$w(DLC) 2009045580$w(OCoLC)377864839
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15082389$zTaylor & Francis eBooks
852 8 $blweb$hEBOOKS