MARC Record from marc_columbia

LEADER: 03640cam a2200745Ma 4500
001 15062951
005 20220627124841.0
006 m o d
007 cr cn|||||||||
008 020508s1999 nyua ob 001 0 eng d
010 $a 99022027
035 $a(OCoLC)ocm49851250
035 $a(NNC)15062951
040 $aN$T$beng$epn$cN$T$dOCLCQ$dYDXCP$dOCLCQ$dOCLCF$dOCLCQ$dOCLCO$dOCLCQ$dYDX$dOCLCQ$dOCLCA$dAU@$dUX1$dUKAHL$dK6U$dOCLCO
019 $a959954402$a960091870$a1100420354$a1109825880$a1124423447
020 $a058540013X$q(electronic bk.)
020 $a9780585400136$q(electronic bk.)
020 $z0824770331
020 $z9780824770334
020 $a9780429181030 (electronic bk)
020 $a0429181035 (electronic bk)
020 $a9781482293203$q(e-book)
020 $a148229320X
035 $a(OCoLC)49851250$z(OCoLC)959954402$z(OCoLC)960091870$z(OCoLC)1100420354$z(OCoLC)1109825880$z(OCoLC)1124423447
050 4 $aTK7870.15$b.M42 1999eb
072 7 $aTEC$x008070$2bisacsh
072 7 $aTEC$x008060$2bisacsh
082 04 $a621.381/046$221
084 $aELT 296f$2stub
084 $aZN 4100$2rvk
084 $aRK 556$2blsrissc
049 $aZCUA
100 1 $aMcKeown, Stephen A.
245 10 $aMechanical analysis of electronic pakaging systems /$cStephen A. McKeown.
260 $aNew York :$bMarcel Dekker,$c©1999.
300 $a1 online resource (ix, 355 pages) :$billustrations.
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
490 1 $aMechanical engineering ;$v120
504 $aIncludes bibliographical references and index.
588 0 $aPrint version record.
520 1 $a"This useful reference fills the niche between purely technical engineering texts and sophisticated engineering software guides - providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems."--BOOK JACKET. "Featuring helpful checklists at the end of each chapter and sample problems (with solutions), this eminently practical resource deserves a place on the bookshelves of all engineers in electronic packaging and related fields. Mechanical Analysis of Electronic Packaging Systems is indispensable for mechanical, electrical, and quality control engineers, and upper-level undergraduate and graduate students in these disciplines."--BOOK JACKET.
650 0 $aElectronic packaging.
650 0 $aMechanical engineering.
650 0 $aSystem analysis.
650 6 $aMise sous boîtier (Électronique)
650 6 $aGénie mécanique.
650 6 $aAnalyse de systèmes.
650 7 $amechanical engineering.$2aat
650 7 $asystems analysis.$2aat
650 7 $aTECHNOLOGY & ENGINEERING$xElectronics$xMicroelectronics.$2bisacsh
650 7 $aTECHNOLOGY & ENGINEERING$xElectronics$xDigital.$2bisacsh
650 7 $aElectronic packaging.$2fast$0(OCoLC)fst00907414
650 7 $aMechanical engineering.$2fast$0(OCoLC)fst01013375
650 7 $aSystem analysis.$2fast$0(OCoLC)fst01141385
650 7 $aElektronisches Bauelement$2gnd
650 7 $aGehäuse$2gnd
650 7 $aMechanische Beanspruchung$2gnd
655 0 $aElectronic books.
655 4 $aElectronic books.
776 08 $iPrint version:$aMcKeown, Stephen A.$tMechanical analysis of electronic pakaging systems.$dNew York : Marcel Dekker, ©1999$z0824770331$w(DLC) 99022027
830 0 $aMechanical engineering (Marcel Dekker, Inc.) ;$v120.
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15062951$zTaylor & Francis eBooks
852 8 $blweb$hEBOOKS