MARC Record from marc_columbia

LEADER: 06241cam a2200697 i 4500
001 14916648
005 20210607122538.0
006 m o d
007 cr cnu---unuuu
008 200103t20202020flua ob 001 0 eng
010 $a 2019060143
035 $a(OCoLC)on1151520737
035 $a(NNC)14916648
040 $aDLC$beng$erda$cDLC$dOCLCO$dOCLCQ$dYDX$dTYFRS$dN$T$dUKAHL$dEBLCP
019 $a1154860026$a1155330489$a1159411495$a1200506187
020 $a9781003029328$qelectronic book
020 $a1003029329$qelectronic book
020 $a9781000047387$qelectronic book
020 $a1000047385$qelectronic book
020 $z9780367465315$qhardcover
020 $a9781000047462$q(electronic bk. : EPUB)
020 $a1000047466$q(electronic bk. : EPUB)
020 $a9781000047424$q(electronic bk. : Mobipocket)
020 $a1000047423$q(electronic bk. : Mobipocket)
020 $z0367465310
035 $a(OCoLC)1151520737$z(OCoLC)1154860026$z(OCoLC)1155330489$z(OCoLC)1159411495$z(OCoLC)1200506187
037 $a9781003029328$bTaylor & Francis
042 $apcc
050 4 $aTK7870.25$b.E43 2020eb
072 7 $aTEC$x005050$2bisacsh
072 7 $aTEC$x007000$2bisacsh
072 7 $aTEC$x008000$2bisacsh
072 7 $aTJF$2bicssc
082 00 $a621.381/044$223
049 $aZCUA
100 1 $aEllison, Gordon N.,$eauthor.
245 10 $aThermal computations for electronics :$bconductive, radiative, and convective air cooling /$cGordon N. Ellison.
250 $aSecond edition.
264 1 $aBoca Raton, FL :$bCRC Press, Taylor & Francis Group,$c2020.
264 4 $c©2020
300 $a1 online resource (xxi, 382 pages) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
504 $aIncludes bibliographical references and index.
520 $a"The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first twenty percent of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems"--$cProvided by publisher.
588 $aDescription based on online resource; title from digital title page (viewed on June 04, 2020).
505 0 $aCover -- Half Title -- Title Page -- Copyright Page -- Dedication -- Table of Contents -- Preface to the Second Edition -- Preface to the First Edition -- About the Author -- Chapter 1: Introduction -- 1.1 Primary Mechanisms of Heat Flow -- 1.2 Conduction -- 1.3 Application Example: Silicon Chip Resistance Calculation -- 1.4 Convection -- 1.5 Application Example: Chassis Panel Cooled by Natural Convection -- 1.6 Radiation -- 1.7 Application Example: Chassis Panel Cooled only by Radiation
505 8 $a1.8 Illustrative Example: Simple thermal Network Model for a Heat Sinked Power Transistor on a Circuit Board -- 1.9 Illustrative Example: Thermal Network Circuit for a Printed Circuit Board -- 1.10 Compact Component Models -- 1.11 Illustrative Example: Pressure and Thermal Circuits for a Forced Air Cooled Enclosure -- 1.12 Illustrative Example: A Single Chip Package on a Printed Circuit Board -- the Problem -- 1.13 Illustrative Example: A Single Chip Package on a Printed Circuit Board -- Fourier Series Analytical Solution
505 8 $a1.14 Illustrative Example: A Single Chip Package on a Printed Circuit Board -- Thermal Network Solution -- 1.15 Illustrative Example: A Single Chip Package on a Printed Circuit Board -- Finite Element Method Solution -- 1.16 Illustrative Example: A Single Chip Package on a Printed Circuit Board -- Three Solution Methods Compared -- Exercises -- Chapter 2: Thermodynamics of Airflow -- 2.1 The First Law of Thermodynamics -- 2.2 Heat Capacity at Constant Volume -- 2.3 Heat Capacity at Constant Pressure -- 2.4 Steady Gas Flow as an Open, Steady, Single Stream
505 8 $a2.5 Air Temperature Rise: Temperature Dependence -- 2.6 Air Temperature Rise: T Identified using Differential forms of ∆T, ∆Q -- 2.7 Air Temperature Rise: T Identified as Average Bulk Temperature -- Exercises -- Chapter 3: Airflow I: Forced Flow in Systems -- 3.1 Preliminaries -- 3.2 Bernoulli's Equation -- 3.3 Bernoulli's Equation with Losses -- 3.4 Fan Testing -- 3.5 Estimate of Fan Test Error Accrued by Measurement of Downstream Static Pressure -- 3.6 Derivation of the "One Velocity" Head Formula -- 3.7 Fan and System Matching -- 3.8 Adding Fans in Series and Parallel
505 8 $a3.9 Airflow Resistance: Common Rlements -- 3.10 Airflow Resistance: True Circuit Boards -- 3.11 Modeled Circuit Board Elements -- 3.12 Combining Airflow Resistances -- 3.13 Application Example: Forced Air Cooled Enclosure -- Exercises -- Chapter 4: Airflow II: Forced Flow in Ducts, Extrusions, and Pin Fin Arrays -- 4.1 The Airflow Problem for Channels with a Rectangular Cross-Section -- 4.2 Entrance and Exit Effects for Laminar and Turbulent Flow -- 4.3 Friction Coefficient for Channel Flow -- 4.4 Application Example: Two-Sided Extruded Heat Sink -- 4.5 A pin Fin Correlation
650 0 $aElectronic apparatus and appliances$xThermal properties$xMathematical models.
650 0 $aElectronic apparatus and appliances$xCooling$xMathematics.
650 7 $aTECHNOLOGY / Construction / Heating, Ventilation & Air Conditioning$2bisacsh
650 7 $aTECHNOLOGY / Electricity$2bisacsh
650 7 $aTECHNOLOGY / Electronics / General$2bisacsh
655 4 $aElectronic books.
776 08 $iPrint version:$aEllison, Gordon N..$tThermal computations for electronics$bSecond edition.$dBoca Raton, FL : CRC Press/Taylor & Francis Group, 2020.$z9780367465315$w(DLC) 2019060142
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio14916648$zTaylor & Francis eBooks
852 8 $blweb$hEBOOKS