| Record ID | marc_columbia/Columbia-extract-20221130-018.mrc:112588416:1805 |
| Source | marc_columbia |
| Download Link | /show-records/marc_columbia/Columbia-extract-20221130-018.mrc:112588416:1805?format=raw |
LEADER: 01805cam a2200493Ia 4500
001 8972442
005 20131118215938.0
006 m d
007 cr cn|
008 110607s2004 enka sb 001 0 eng d
020 $a9781615839629 (electronic bk.)
020 $a1615839623 (electronic bk.)
035 $a(OCoLC)ocn729386039
035 $a(OCoLC)729386039
035 $a(NNC)8972442
037 $bKnovel Corporation$nhttp://www.knovel.com
040 $aKNOVL$cKNOVL
050 14 $aTK7874$b.M46 2004eb
082 04 $a621.381$222
084 $a53.55$2bcl
084 $a53.32$2bcl
084 $aTEC 025f$2stub
084 $aZN 4980$2rvk
245 00 $aMEMS packaging$h[electronic resource] /$cedited by Tai-Ran Hsu.
260 $aLondon :$bINSPEC,$cc2004.
300 $axxix, 275 p. :$bill. ;$c26 cm.
490 1 $aEMIS processing series ;$vno. 3
504 $aIncludes bibliographical references and index.
533 $aElectronic reproduction.$bNorwich, N.Y. :$cKnovel,$d2011.$nSystem requirements: Adobe Acrobat Reader.$nAvailable via the World Wide Web.$nAccess restricted to users at licensed institutions.$nIncludes interactive index.
650 0 $aMicroelectromechanical systems.
650 0 $aMicroelectronic packaging.
650 6 $aMicromachines.
650 6 $aMise sous boîtier (Microélectronique)
650 07 $aBauelement.$2swd
650 07 $aMikroelektronik.$2swd
650 07 $aMikromechanik.$2swd
655 4 $aElectronic books.
700 1 $aHsu, Tai-Ran.
710 2 $aINSPEC (Information service)
710 2 $aKnovel (Firm)
776 1 $cOriginal$z0863413358$w(OCoLC)53030765
830 0 $aEMIS processing series ;$vno. 3.
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio8972442$zClick here for full text.
852 8 $blweb$hEBOOKS