| Record ID | marc_columbia/Columbia-extract-20221130-014.mrc:149392521:1622 |
| Source | marc_columbia |
| Download Link | /show-records/marc_columbia/Columbia-extract-20221130-014.mrc:149392521:1622?format=raw |
LEADER: 01622cam a2200373 a 4500
001 6947944
005 20221130194304.0
008 071212t20082008gw a b 001 0 eng
020 $a9783527320349 (set)
020 $a3527320342 (set)
024 $a40015976895
035 $a(OCoLC)ocn244648058
035 $a(OCoLC)244648058
035 $a(NNC)6947944
035 $a6947944
040 $aUKM$cUKM$dBWX$dNhCcYBP
042 $aukblsr
050 4 $aTK7874$b.H36 2008
082 04 $a621.3815$222
245 00 $aHandbook of 3D integration :$btechnology and applications of 3D integrated circuits /$cedited by Philip Garrou, Christopher Bower and Peter Ramm.
260 $aWeinheim :$bWiley-VCH,$c[2008], ©2008.
300 $a2 volumes (xxvi, 773 pages) :$billustrations (some color) ;$c25 cm
336 $atext$btxt$2rdacontent
337 $aunmediated$bn$2rdamedia
504 $aIncludes bibliographical references and index.
650 0 $aIntegrated circuits.$0http://id.loc.gov/authorities/subjects/sh85067117
650 0 $aIntegrated circuits$xDesign and construction.$0http://id.loc.gov/authorities/subjects/sh85067118
650 0 $aSemiconductor wafers.$0http://id.loc.gov/authorities/subjects/sh85119902
650 0 $aThree-dimensional imaging.$0http://id.loc.gov/authorities/subjects/sh2001000478
700 1 $aGarrou, Philip E.$0http://id.loc.gov/authorities/names/n98000500
700 1 $aBower, Christopher Andrew.$0http://id.loc.gov/authorities/names/no2001054717
700 1 $aRamm, Peter.$0http://id.loc.gov/authorities/names/nb2008017723
852 01 $boff,eng$hTK7874$i.H36 2008g
866 41 $80$av.1-2