MARC record from Internet Archive

LEADER: 04684cam a22007214a 4500
001 13725295
005 20220703224252.0
006 m o d
007 cr |n|||||||||
008 060405s2006 nyua ob 001 0 eng c
010 $a 2006011500
035 $a(OCoLC)ocn471136049
035 $a(NNC)13725295
040 $aCOO$beng$epn$cCOO$dQE2$dE7B$dOCLCQ$dDEBBG$dOCLCQ$dKNOVL$dB24X7$dN$T$dOPELS$dIDEBK$dKNOVL$dZCU$dKNOVL$dOCLCF$dKNOVL$dYDXCP$dOCLCQ$dAU@$dOCLCQ$dSTF$dVT2$dOCLCQ$dUAB$dOCLCQ$dREB$dD6H$dCEF$dRRP$dCOO$dWYU$dLEAUB$dSFB$dOCLCO
016 $a000040160570$2AU
019 $a180841322$a271043688$a281606152$a647803467$a823842873$a823910993$a824098883$a824154174$a961885767$a988619288$a999440771$a1026452725$a1058067240$a1065841440$a1136340810
020 $a0815515235$q(08155)
020 $a9780815515234$q(08155)
020 $a9780815519195$q(electronic bk.)
020 $a0815519192$q(electronic bk.)
020 $a9781601193582$q(electronic bk.)
020 $a1601193580$q(electronic bk.)
020 $a1282253107
020 $a9781282253100
020 $a9786612253102
020 $a661225310X
020 $a0080947239
020 $a9780080947235
035 $a(OCoLC)471136049$z(OCoLC)180841322$z(OCoLC)271043688$z(OCoLC)281606152$z(OCoLC)647803467$z(OCoLC)823842873$z(OCoLC)823910993$z(OCoLC)824098883$z(OCoLC)824154174$z(OCoLC)961885767$z(OCoLC)988619288$z(OCoLC)999440771$z(OCoLC)1026452725$z(OCoLC)1058067240$z(OCoLC)1065841440$z(OCoLC)1136340810
037 $a153953:154113$bElsevier Science & Technology$nhttp://www.sciencedirect.com
042 $apcc
050 4 $aTA418.7$b.E24 2006
072 7 $aTEC$x027000$2bisacsh
072 7 $aTGM$2bicssc
082 04 $a620/.44$222
049 $aZCUA
100 1 $aEbnesajjad, Sina.
245 10 $aSurface treatment of materials for adhesion bonding /$cby Sina Ebnesajjad ; assisted by Cyrus F. Ebnesajjad.
260 $aNorwich, NY, U.S.A. :$bWilliam Andrew Pub.,$c©2006.
300 $a1 online resource (xvi, 260 pages) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
504 $aIncludes bibliographical references and index.
505 0 $aPart I: Background and Theory -- Introduction to Surface Preparation -- Surface Tension and its Measurement -- Surface Energy of Solids -- Surface and Material Characterization Techniques -- Theories of Adhesion -- Part II: Surface Treatment Methods and Techniques -- Material Surface Preparation Techniques -- Surface Preparation of Metals -- Surface Preparation of Thermoplastics, Thermosets, and Elastomers -- Index.
520 $aThis is a unique compilation of surface preparation principles and techniques for plastics, thermosets, elastomers, and metals bonding. With emphasis on the practical, it draws together in a single source technical principles of surface science and surface treatments technologies of plastics, elastomers, and metals. It is both a reference and a guide for engineers, scientists, practitioners of surface treatment, researchers, students, and others involved in materials adhesion and processing. This book describes and illustrates the surface preparations and operations that must be applied to a surface before acceptable adhesive bonding is achieved. It is meant to be a comprehensive overview, including more detailed explanation where necessary, in a continuous and logical progression. This book is intended to be a handbook for reference of surface treating processes. The more technical chapters can be bypassed to study the applied chapters. The text is accessible to readers with a college-level background in mathematics and chemistry, but an in-depth knowledge of adhesion technology is not required.
506 $aOnline access available only to subscribers.
546 $aEnglish.
650 0 $aSurfaces (Technology)
650 0 $aAdhesion.
650 6 $aSurfaces (Technologie)
650 6 $aAdhésion (Physique)
650 7 $aadhesion.$2aat
650 7 $aTECHNOLOGY & ENGINEERING$xNanotechnology & MEMS.$2bisacsh
650 7 $aAdhesion.$2fast$0(OCoLC)fst00796596
650 7 $aSurfaces (Technology)$2fast$0(OCoLC)fst01139278
655 0 $aElectronic books.
655 4 $aElectronic books.
700 1 $aEbnesajjad, Cyrus F.
776 08 $iPrint version:$aEbnesajjad, Sina.$tSurface treatment of materials for adhesion bonding.$dNorwich, NY, U.S.A. : William Andrew Pub., ©2006$w(DLC) 2006011500
830 0 $aKnovel Library.
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio13725295$zACADEMIC - Electronics & Semiconductors
852 8 $blweb$hEBOOKS