| Record ID | ia:modernsoldertech0000hwan |
| Source | Internet Archive |
| Download MARC XML | https://archive.org/download/modernsoldertech0000hwan/modernsoldertech0000hwan_marc.xml |
| Download MARC binary | https://www.archive.org/download/modernsoldertech0000hwan/modernsoldertech0000hwan_meta.mrc |
LEADER: 00847cam a2200241 a 4500
001 95044641
003 DLC
005 20020815200710.0
008 950929s1996 nyua b 001 0 eng
010 $a 95044641
020 $a0070317496 (hc : acid-free paper)
040 $aDLC$cDLC$dDLC
050 00 $aTK7870.15$b.H93 1996
082 00 $a621.381/046$220
100 1 $aHwang, Jennie S.
245 10 $aModern solder technology for competitive electronics manufacturing /$cJennie S. Hwang.
260 $aNew York :$bMcGraw-Hill,$cc1996.
300 $axliv, 622 p. :$bill. ;$c24 cm.
440 0 $aElectronic packaging and interconnection series
504 $aIncludes bibliographical references and index.
650 0 $aElectronic packaging.
650 0 $aSolder and soldering.
856 41 $3Table of contents$uhttp://www.loc.gov/catdir/toc/mh022/95044641.html