| Record ID | harvard_bibliographic_metadata/ab.bib.11.20150123.full.mrc:798336632:1332 |
| Source | harvard_bibliographic_metadata |
| Download Link | /show-records/harvard_bibliographic_metadata/ab.bib.11.20150123.full.mrc:798336632:1332?format=raw |
LEADER: 01332nam a2200325Ia 4500
001 011895121-1
005 20090319111230.0
008 090303s2008 waua b 101 0 eng d
020 $a9780819475213
020 $a0819475211
035 0 $aocn311868058
040 $aLHL$cLHL
050 00 $aTK7875$b.M522 2008
090 $aTK7875$b. M453 2008
245 00 $aMicro- and nanotechnology :$bmaterials, processes, packaging, and systems IV : 10-12 December 2008, Melbourne, Australia /$cJung-Chih Chiao ... [et al.], editors ; sponsored [and] published by SPIE ; cosponsored by RMIT University (Australia).
246 30 $aMaterials, processes, packaging, and systems IV
260 $aBellingham, Wash. :$bSPIE,$cc2008.
300 $a1 v. (various pagings) :$bill. ;$c28 cm.
490 1 $aProceedings of SPIE,$x0277-786X ;$vv. 7269
504 $aIncludes bibliographical references and index.
650 0 $aMicroelectromechanical systems$vCongresses.
650 0 $aMicrotechnology$xMaterials$vCongresses.
650 0 $aNanotechnology$xMaterials$vCongresses.
650 0 $aElectronic packaging$vCongresses.
700 1 $aChiao, Jung-Chih.
710 2 $aSPIE (Society)
710 2 $aRMIT University.
830 0 $aProceedings of SPIE--the International Society for Optical Engineering ;$vv. 7269.
988 $a20090319
906 $0OCLC