An edition of Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
(2019)
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Materials, Processes, Equipment, and Reliability
by Kim S. Siow
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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Jan 29, 2019, Springer
hardcover
3319992554 9783319992556
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Source title: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
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| June 8, 2020 | Created by ImportBot | import new book |