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Last edited by RenameBot
August 21, 2008 | History
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Tai-Ran Hsu

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9 works Add another?

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  • Cover of: MEMS & microsystems: design and manufacture

    First published in 2001 8 editions in 1 language — 1 previewable
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  • Cover of: The finite element method in thermomechanics

    First published in 1986 4 editions in 1 language — 1 previewable
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  • Cover of: Applied Engineering Analysis

    First published in 2017 4 editions in 1 language
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  • Cover of: MEMS packaging

    First published in 2004 3 editions in 1 language
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  • Cover of: Advances in electronic packaging, 1995: proceedings of the International Intersociety Electronic Packaging Conference--INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

    First published in 1995 2 editions in 1 language
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  • Cover of: Mems Packaging (Emis Processing)

    First published in 2003 2 editions in 2 languages
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  • Cover of: Computer-Aided Design: An Integrated Approach

    First published in 1991 2 editions in 1 language — 1 previewable
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  • Cover of: Computer-Aided Design: An Integrated Approach

    First published in 1991 1 edition in 1 language
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  • Cover of: Finite element analysis by microcomputers

    First published in 1988 1 edition in 1 language
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We need a photo of Tai-Ran Hsu

Subjects
Data processing, Microelectromechanical systems, Microelectronic packaging, Mikroelektronik, Mikromechanik, 621.381, Bauelement, Computer-aided design, Conception et construction, Congresses, Continuum mechanics, Electronic packaging, Engineering design, Engineering mathematics, Finite element method, Ma24, Matériaux, Me40, Mechanical, Microelectronics, Microsystèmes électromécaniques, Mise sous boîtier (Microélectronique), Nanotechnologie, St23, Systèmes microélectromécaniques

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ID Numbers

  • OLID: OL893598A

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History

Download catalog record: RDF / JSON
August 21, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import