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Last edited anonymously
April 29, 2008 | History
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Jan Vardaman

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6 works Add another?

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  • Cover of: Surface Mount Technology: Recent Japanese Developments

    First published in 1992 1 edition in 1 language
    Not in Library

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  • Cover of: Worldwide developments in MCP integration: markets & trends

    First published in 1998 1 edition in 1 language
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  • Cover of: High-density microvia substrates: markets, applications, and infrastructure

    First published in 1999 1 edition in 1 language
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  • Cover of: The lead-free movement: environmentally friendly electronics manufacturing

    First published in 2000 1 edition in 1 language
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  • Cover of: Flexible circuits for high density applications

    First published in 2000 1 edition in 1 language
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  • Cover of: Flip chip markets and infrastructure developments

    First published in 2001 1 edition in 1 language
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Subjects
Electronic industries, Integrated circuits industry, Market surveys, Microelectronic packaging, Electronic packaging, Environmental aspects, Environmental protection, Flexible printed circuits, Flip chip technology, Lead-free electronics manufacturing processes, Multichip modules (Microelectronics), Technological innovations

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ID Numbers

  • OLID: OL2857957A

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History

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April 29, 2008 Created by an anonymous user initial import