Application of fracture mechanics in electronic packaging and materials

presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

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Last edited by MARC Bot
July 31, 2019 | History

Application of fracture mechanics in electronic packaging and materials

presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Language
English
Pages
271

Buy this book

Previews available in: English

Book Details


Published in

New York

Edition Notes

Includes bibliographical references and index.
Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition.

Series
EEP ;, vol. 11, MD ;, vol. 64, EEP (Series) ;, v. 11., MD (Series) ;, v. 64.

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7870.15 .I584 1995

The Physical Object

Pagination
vi, 271 p. :
Number of pages
271

ID Numbers

Open Library
OL824808M
ISBN 10
0791817369
LCCN
95081270
OCLC/WorldCat
34382957
Goodreads
1584485

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
July 31, 2019 Edited by MARC Bot associate edition with work OL8359641W
April 14, 2010 Edited by bgimpertBot Added goodreads ID.
April 1, 2008 Created by an anonymous user Imported from Scriblio MARC record.