Check nearby libraries
Buy this book
This edition doesn't have a description yet. Can you add one?
Check nearby libraries
Buy this book
Previews available in: English
Showing 2 featured editions. View all 2 editions?
Edition | Availability |
---|---|
1
Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition ... Francisco, California (Eep (Series), V. 11.)
June 1995, American Society of Mechanical Engineers
Paperback
in English
0791817369 9780791817360
|
cccc
Libraries near you:
WorldCat
|
2
Application of fracture mechanics in electronic packaging and materials: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
1995, American Society of Mechanical Engineers
in English
0791817369 9780791817360
|
aaaa
Libraries near you:
WorldCat
|
Book Details
Edition Notes
Includes bibliographical references and index.
Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition.
Classifications
The Physical Object
ID Numbers
Community Reviews (0)
Feedback?History
- Created April 1, 2008
- 3 revisions
Wikipedia citation
×CloseCopy and paste this code into your Wikipedia page. Need help?
July 31, 2019 | Edited by MARC Bot | associate edition with work OL8359641W |
April 14, 2010 | Edited by bgimpertBot | Added goodreads ID. |
April 1, 2008 | Created by an anonymous user | Imported from Scriblio MARC record |