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April 14, 2010 | History
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Application of fracture mechanics in electronic packaging and material ...
sponsored by the Electrical an ...
Application of fracture mechanics in electronic packaging and material ...
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Application of fracture mechanics in electronic packaging and materials
presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.].
Published
1995
by
American Society of Mechanical Engineers
in
New York
.
Written in English.
Edition Notes
Includes bibliographical references and index.
Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition.
| Series | EEP ;, vol. 11, MD ;, vol. 64, EEP (Series) ;, v. 11., MD (Series) ;, v. 64. |
Classifications
| Dewey Decimal Class | 621.381/046 |
| Library of Congress | TK7870.15 .I584 1995 |
The Physical Object
| Pagination | vi, 271 p. : |
| Number of pages | 271 |
History Created April 1, 2008 · 2 revisions
| April 14, 2010 | Edited by bgimpertBot | Added goodreads ID. |
| April 1, 2008 | Created by an anonymous user | Initial record created, from Scriblio MARC record. |