Cover of: Microelectronic packaging technology by ASM International Electronic Materials and Processing Congress (2nd 1989 Philadelphia, Pa.)

Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

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Last edited by Open Library Bot
December 4, 2010 | History

Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read
Publish Date
Publisher
ASM International
Language
English
Pages
479

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Book Details


Published in

Metals Park, Ohio

Edition Notes

Includes bibliographies.
Cover title: Micro electronic packaging technology.
"SAN 204-7586"--T.p. verso.

Other Titles
Micro electronic packaging technology.

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7874 .A77 1989

The Physical Object

Pagination
xii, 479 p. :
Number of pages
479

ID Numbers

Open Library
OL2228528M
Internet Archive
microelectronicp0000asmi
ISBN 10
0871703599
LCCN
89080612
Library Thing
1452612
Goodreads
4602840

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History

Download catalog record: RDF / JSON
December 4, 2010 Edited by Open Library Bot Added subjects from MARC records.
April 28, 2010 Edited by Open Library Bot Linked existing covers to the work.
December 10, 2009 Created by WorkBot add works page