Microelectronics Packaging Fund

1st edition
  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read
Microelectronics Packaging Fund
Rao R. Tummala, Eugene J. Ryma ...
Not in Library

My Reading Lists:

Create a new list

Check-In

×Close
Add an optional check-in date. Check-in dates are used to track yearly reading goals.
Today

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

Buy this book

Last edited by ImportBot
November 2, 2021 | History

Microelectronics Packaging Fund

1st edition
  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

This edition doesn't have a description yet. Can you add one?

Publish Date
Language
English
Pages
864

Buy this book

Edition Availability
Cover of: Microelectronics Packaging Fund
Microelectronics Packaging Fund
April 15, 2001, International Thomson Publishing Services Ltd
Hardcover in English - 1st edition

Add another edition?

Book Details


Classifications

Library of Congress
QA76.635

The Physical Object

Format
Hardcover
Number of pages
864

ID Numbers

Open Library
OL10184209M
ISBN 10
041214901X
ISBN 13
9780412149016
OCLC/WorldCat
228377252
Goodreads
4925161

Source records

Better World Books record

Community Reviews (0)

Feedback?
No community reviews have been submitted for this work.

Lists

This work does not appear on any lists.

History

Download catalog record: RDF / JSON
November 2, 2021 Created by ImportBot import existing book