Microelectronics Packaging Handbook, Part III

Subsystem Packaging (Microelectronics Packaging Handbook)

  • 0 Ratings
  • 2 Want to read
  • 0 Currently reading
  • 0 Have read

My Reading Lists:

Create a new list

Check-In

×Close
Add an optional check-in date. Check-in dates are used to track yearly reading goals.
Today

  • 0 Ratings
  • 2 Want to read
  • 0 Currently reading
  • 0 Have read

Buy this book

Last edited by ImportBot
December 19, 2023 | History

Microelectronics Packaging Handbook, Part III

Subsystem Packaging (Microelectronics Packaging Handbook)

  • 0 Ratings
  • 2 Want to read
  • 0 Currently reading
  • 0 Have read

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
Springer
Language
English
Pages
628

Buy this book

Previews available in: English

Edition Availability
Cover of: Microelectronics Packaging Handbook, Part II
Cover of: Microelectronics Packaging Handbook, Part III
Cover of: Microelectronics Packaging Handbook, Part I
Cover of: Microelectronics packaging handbook
Microelectronics packaging handbook
1997, Chapman & Hall
in English - 2nd ed.

Add another edition?

Book Details


First Sentence

"Packaged electronics is the embodiment of all electronic equipmentcalculators, personal computers (PCs), mainframe computers, telephones, television, and so forth."

Classifications

Library of Congress
TK7874 .M485 1997, QA76.635

ID Numbers

Open Library
OL7478234M
Internet Archive
microelectronics0000unse_n6p1
ISBN 10
0412084511
ISBN 13
9780412084515
LCCN
96037907
Goodreads
4925160

Community Reviews (0)

Feedback?
No community reviews have been submitted for this work.

Lists

This work does not appear on any lists.

History

Download catalog record: RDF / JSON
December 19, 2023 Edited by ImportBot import existing book
February 13, 2022 Edited by ImportBot import existing book
August 4, 2020 Edited by ImportBot import existing book
April 2, 2019 Created by MARC Bot import existing book