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July 30, 2014 | History

Chemical mechanical polishing in silicon processing 1 edition

By unknown author
Cover of: Chemical mechanical polishing in silicon processing |

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Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)

Published October 15, 1999 by Academic Press .
Written in English.

First Sentence

Chemical mechanical planarization (CMP) has become, in a few short years, a required semiconductor processing module used in fabrication facilities worldwide.

The Physical Object

Format
Hardcover
Number of pages
307
Dimensions
9.3 x 6.2 x 0.8 inches
Weight
1.3 pounds

ID Numbers

Open Library
OL9413699M
Internet Archive
chemicalmechanic00lish
ISBN 10
0127521720
ISBN 13
9780127521725
Library Thing
4669750
Goodreads
3372115

History Created July 30, 2014 · 1 revision Download catalog record: RDF / JSON

July 30, 2014 Created by ImportBot import new book