Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)

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July 30, 2014 | History

Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
Academic Press
Language
English
Pages
307

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Previews available in: English

Edition Availability
Cover of: Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)
Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)
October 15, 1999, Academic Press
Hardcover in English

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Book Details


First Sentence

"Chemical mechanical planarization (CMP) has become, in a few short years, a required semiconductor processing module used in fabrication facilities worldwide."

The Physical Object

Format
Hardcover
Number of pages
307
Dimensions
9.3 x 6.2 x 0.8 inches
Weight
1.3 pounds

ID Numbers

Open Library
OL9413699M
Internet Archive
chemicalmechanic00lish
ISBN 10
0127521720
ISBN 13
9780127521725
Library Thing
4669750
Goodreads
3372115

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July 30, 2014 Created by ImportBot import new book