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Last edited by WorkBot
January 24, 2010 | History

Comparison of convective and resistive thermal cycling of circuit board vias 1 edition

Comparison of convective and resistive thermal cycling of circuit boar ...
Rex Lam

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Comparison of convective and resistive thermal cycling of circuit board vias.

Published 2006 .
Written in English.

About the Book

An experiment was conducted to compare two methods of accelerated reliability testing of plated through vias (PTV), Interconnect Stress Testing (IST) and Accelerated Thermal Cycling (ATC), to see if the two tests produce the same reliability results for the same set of samples. Statistical and finite element analyses of the test data led to the conclusion that both IST and ATC produce the same results for high aspect ratio PTVs in circuit boards constructed with one of three different laminate materials. Cross-sections of samples from ATC and IST also conclude that the failure modes were consistent between the two test methods.

Edition Notes

Source: Masters Abstracts International, Volume: 44-06, page: 2973.

Thesis (M.A.Sc.)--University of Toronto, 2006.

Electronic version licensed for access by U. of T. users.

ROBARTS MICROTEXT copy on microfiche.

The Physical Object

Pagination
64 leaves.
Number of pages
64

ID Numbers

Open Library
OL19215802M
ISBN 13
9780494163672

History

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January 24, 2010 Edited by WorkBot add more information to works
December 11, 2009 Created by WorkBot add works page