| Record ID | marc_records_scriblio_net/part20.dat:156730625:1363 |
| Source | Scriblio |
| Download Link | /show-records/marc_records_scriblio_net/part20.dat:156730625:1363?format=raw |
LEADER: 01363pam 2200289 a 4500
001 89037412
003 DLC
005 19891206092841.4
008 890705s1989 dcua b 10100 eng
010 $a 89037412
020 $a0841216797
040 $aDLC$cDLC$dDLC
050 00 $aTK7870$b.P654 1989
082 00 $a621.381/046$220
245 00 $aPolymeric materials for electronics packaging and interconnection /$cJohn H. Lupinski, editor, Robert S. Moore, editor.
260 0 $aWashington, DC :$bAmerican Chemical Society,$c1989.
300 $axi, 499 p. :$bill. ;$c24 cm.
440 0 $aACS symposium series ;$v407
500 $a"Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."
504 $aIncludes bibliographical references.
650 0 $aElectronic packaging$xMaterials$xCongresses.
650 0 $aPolymers$xCongresses.
700 10 $aLupinski, John H.,$d1927-
700 10 $aMoore, Robert S.,$d1933-
710 20 $aAmerican Chemical Society.$bDivision of Polymeric Materials:$bScience and Engineering.
710 20 $aAmerican Chemical Society.$bDivision of Polymer Chemistry.
710 20 $aAmerican Chemical Society.$bMeeting$n(196th :$d1988 :$cLos Angeles, Calif.)