Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III

Subsystem Packaging

by R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Published in January 31, 1997, Springer

Microelectronics Packaging Handbook, 3-part set: Part I: Technology D ...

R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

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Language:	English
Edition:	2nd ed. edition
Format:	Hardcover
Dimensions:	9.5 x 6.5 x 5 inches
ISBN 10:	0412084619
ISBN 13:	9780412084614
Subject:	Electronics engineering Reference works Computers Technology & Industrial Arts Computer Books: General Computer Architecture - General Electronics - Semiconductors Engineering - Electrical & Electronic Computers / Computer Architecture