{"isbn_13": ["9780412084614"], "physical_format": "Hardcover", "subtitle": "Subsystem Packaging", "last_modified": {"type": "/type/datetime", "value": "2008-04-30 09:38:13.731961"}, "languages": [{"key": "/l/eng"}], "publishers": ["Springer"], "number_of_pages": 3000, "id": 13060392, "edition_name": "2nd ed. edition", "isbn_10": ["0412084619"], "publish_date": "January 31, 1997", "key": "/b/OL9724966M", "authors": [{"key": "/a/OL2692187A"}, {"key": "/a/OL2692188A"}, {"key": "/a/OL2692189A"}], "title": "Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III", "type": {"key": "/type/edition"}, "subjects": ["Electronics engineering", "Reference works", "Computers", "Technology & Industrial Arts", "Computer Books: General", "Computer Architecture - General", "Electronics - Semiconductors", "Engineering - Electrical & Electronic", "Computers / Computer Architecture"], "physical_dimensions": "9.5 x 6.5 x 5 inches", "revision": 1}