{"isbn_13": ["9780071428279"], "subtitle": "Techniques in High Density Electronics", "last_modified": {"type": "/type/datetime", "value": "2008-04-29 13:35:46.87638"}, "languages": [{"key": "/l/eng"}], "publishers": ["McGraw-Hill Professional"], "number_of_pages": 204, "first_sentence": {"type": "/type/text", "value": "The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes."}, "isbn_10": ["0071428275"], "publish_date": "October 24, 2003", "key": "/b/OL7300245M", "authors": [{"key": "/a/OL507020A"}], "title": "Area Array Package Design", "type": {"key": "/type/edition"}, "id": 9949732, "revision": 1}