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Microelectronics Packaging Handbook, Part III
by
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer, January 31, 1997
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Microelectronics Packaging Handbook, Vol.s 1-3
by
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer, January 15, 1997
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Microelectronics Packaging Handbook, Part I
by
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer, January 15, 1997
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Microelectronics Packaging Handbook, Part II
by
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer, January 31, 1997
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Microelectronics Packaging Handbook
by
R.R. Tummala
Springer, December 31, 1988
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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III
by
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer, January 31, 1997
Hardcover
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